22nd IEEE Latin-American Test Symposium

Punta del Este, Uruguay, 27th - 29th October 2021

 

EXTENDED DEADLINES

 

Due to several requests, we have extended our submission deadlines. Here are the new dates:

EXTENDED Submission Deadline (Title and Abstract):  May 14th, 2021

EXTENDED Submission Deadline (Full paper): May 21st, 2021

 

For more details please check our Submission section [here] or directly access the link below:

https://easychair.org/conferences/?conf=lats2021

 

 

WELCOME BACK TO LATS - WELCOME BACK TO PUNTA DEL ESTE

 

We are looking forward to leave a difficult and challenging year behind and get back together.

Punta del Este is one of the most beautiful places in Uruguay to gather the test community and enjoy

a fruitful exchange regarding the state-of-the-art in test and reliability of integrated circuits and systems.

 

Please check this year's preliminary Call for Papers [here].

 

 

Casapueblo - hotel, restaurant, museum and the very best place to enjoy  sunset

THE 2021 EVENT

 

The IEEE Latin-American Test Symposium (LATS) is a recognized test and fault tolerance techniques forum attended by professionals from all over the world, in particular from Latin-America, to present and discuss various aspects of system, board, and component testing as well as design, manufacturing and in-field considerations with fault tolerance in mind. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. Further, the best papers of its 22nd edition will be invited to re-submit to IEEE Design&Test, Journal of Electronic Testing: Theory and Applications (JETTA - Springer) and IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

 

 

Topics of interest include but are not limited to:

 

CAD for robust circuits design

Cross-layer reliability approaches

Dependable system design

Dependable Computer Architectures

Design for Electromagnetic Compatibility (EMC)

Design for reliability

Design for reliability approaches for Low-Power

Design for Robustness

Design for Security

Fault-based attacks and countermeasures

Fault-tolerant and fail-safe systems

Field Diagnosis, maintainability, and reconfiguration

Functional safety

IC- and system-level radiation hardening techniques

 

 

 

 

 

 

Infrastructure, cloud computing, and wired, cellular

and satellite communications

Memory test and repair

On-line monitoring

On-line testing techniques

Power density and overheating issues in

nanometer technologies

Quality, yield, reliability and lifespan issues

in nanometer technologies

Reliability issues of Low-Power Design

Robustness evaluation

Self-Adapting design

Self-checking circuits and coding theory

Self-Healing design

Self-Regulating design

Self-test and self-repair

Variability, Aging, EMI, and Radiation Effects in              nanometer technologies

PAPER SUBMISSION INFORMATION

 

On behalf of the organizing committee, we would like to thank all those who already contributed with their submissions. Soon we will have concluded our thorough review process and notify all authors regarding the selection results.

 

For additional information, please contact our Program Co-Chairs:

 

Leticia Bolzani Poehls – RWTH Aachen, Germany  ([email protected])

Fabian Luis Vargas - PUCRS, Brazil ([email protected])

 

 

IMPORTANT DATES

EXTENDED Submission Deadline (Title and Abstract):  May 14th, 2021

EXTENDED Submission Deadline (Full paper): May 21st, 2021

Notification of Acceptance:  June 18th, 2021

Camera Ready: July 2nd, 2021.

 

 

 

To download the Call for Papers, please click [here].

 

 

 

 

SPONSORS

 

Organized by:                                                                      Financial Sponsor:

 

 

 

 

Tima, France                                                                       IEEE Council on Electronic Design Automation

 

 

 

Technical Co-Sponsors:

 

The Institute of Electrical and                                              Test Technology

Electronics Engineering, Inc.                                               Technical Council